Wolfspeed Software Engineer interview experience

The final stage was a panel interview with six different people, which was exhausting, and it also required a presentation of my research.

The role itself was very specific: thermal analysis on SiC chips, so the questions leaned heavily into thermodynamics, heat transfer, and materials. I felt like the offer was coming after the final round, and I even negotiated with the hiring manager afterward. But the process broke when my salary request needed approval from upper management, and I never heard back. Instead, they scheduled interviews with other candidates and ultimately rescinded my